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Gigabyte B560M DS3H LGA1200 Motherboard (rev. 1.0) specifications and price in Egypt

Gigabyte B560M DS3H LGA1200 Motherboard (rev. 1.0)

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In Stock from 1 seller store

Price in Egypt:

2,100 EGP

Features

:
  • Supports 11th and 10th Gen Intel® Core™ Series Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
  • Direct 6+2 Phases Digital VRM Solution with Low RDS(on) MOSFETs
  • Dual Ultra-Fast NVMe PCIe 4.0/3.0* x4 M.2
  • GIGABYTE Exclusive 8118 Gaming LAN with Bandwidth Management
  • USB 3.2 Gen1 Type-C® for Fast and Versatile Connections
  • High Quality Audio Capacitors and Audio Noise Guard with LED Trace Path Lighting
  • RGB FUSION 2.0 Supports Addressable LED & RGB LED Strips
  • Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
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Specifications:

  • CPU: LGA1200 package:11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors** Limited to processors with 4 MB Intel® Smart Cache, Intel® Celeron® G5xx5 family.L3 cache varies with CPU
  • Chipset: Intel® B560 Express Chipset
  • Memory:11th Generation Intel® Core™ i9/i7/i5 processors:Support for DDR4 5333(O.C.) / DDR4 5133(O.C.) / DDR4 5000(O.C.) / 4933(O.C.) / 4800(O.C.) / 4700(O.C.) / 4600(O.C.) / 4500(O.C.) / 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz10th Generation Intel® Core™ i9/i7 processors:Support for DDR4 2933/2666/2400/2133 MHz memory modules10th Generation Intel® Core™ i5/i3/Pentium®/Celeron® processors:Support for DDR4 2666/2400/2133 MHz memory modules4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memoryDual channel memory architectureSupport for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modulesSupport for Extreme Memory Profile (XMP) memory modules
  • Audio: Realtek® Audio CODECHigh Definition Audio2/4/5.1/7.1-channel
  • LAN:Realtek® GbE LAN chip (1000/100 Mbit)Expansion Slots1 x PCI Express x16 slot, running at x16(The PCIEX16 slot conforms to PCI Express 4.0 standard.) (Note)2 x PCI Express x1 slots
  • Storage InterfaceCPU:1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_CPU) (Note)Chipset:1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/ x2 SSD support) (M2A_SB)6 x SATA 6Gb/s connectors
  • USBChipset:1 x USB Type-C® port on the back panel, with USB 3.2 Gen 1 support5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)4 x USB 2.0/1.1 ports available through the internal USB headersChipset+USB 2.0 Hub:2 x USB 2.0/1.1 ports on the back panelInternal I/O Connectors1 x 24-pin ATX main power connector1 x 8-pin ATX 12V power connector1 x CPU fan header3 x system fan headers1 x addressable LED strip header1 x RGB LED strip header6 x SATA 6Gb/s connectors2 x M.2 Socket 3 connectors1 x front panel header1 x front panel audio header1 x USB 3.2 Gen 1 header2 x USB 2.0/1.1 headers
  • Operating System: Support for Windows 10 64-bitForm
  • Factor: Micro ATX Form Factor; 24.4cm x 24.4cm
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    Price comparison & Seller Stores:

    Store Stock Price
    Time Tech
    Time TechOut of Stock
    Compu Nile
    Compu NileIn Stock2,100 EGP

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