DarkFlash DY470 Mid Tower Case
Features
- Three ultra-transparent glass panels
- Supports ATX back-connect motherboards
- Includes four ARGB cooling fans
- Vertical and horizontal GPU slots
- Dual 360mm radiator support
- Full dust-proof coverage with pull-out filters
- USB 3.2 Gen2 Type-C front I/O
- Diamond-inspired exterior design
- Wave-pattern cable management plate
- Tool-free internal layout
DarkFlash DY470 Mid Tower Case Price In Egypt
Current market price is 5,750 EGP and is sold at Quantum Technology
Price ranges from 5,750 EGP up to 5,850 EGP with an average of 5,800 EGP
Seller Stores Comparison
| Store | Stock | Price | Buy | |
|---|---|---|---|---|
| Quantum Technology | 5,750 - 5,850 EGP 5,750 EGP 5,850 EGP | |||
Description
The DarkFlash DY470 is a mid tower case that blends artistic design with high-performance functionality. Its diamond-inspired exterior features irregular glass facets across three sides, creating a striking visual effect that showcases internal components. The case supports ATX back-connect motherboards, allowing for cleaner cable routing and a minimalist interior layout.
Cooling is a key strength, with support for dual 360mm radiators and up to ten 120mm fans. Four ARGB fans come preinstalled, delivering vibrant lighting and efficient airflow out of the box. The case includes both vertical and horizontal PCIe slots, offering flexible GPU mounting options to suit different build styles.
Dust management is handled through full coverage filters with a pull-out design, making maintenance simple and effective. The wave-pattern cable management backplate helps conceal wiring, contributing to a clean and organized build. Tool-free drive bays and modular panels further streamline the installation process.
With its combination of aesthetic appeal and builder-friendly features, the DY470 is ideal for gamers and PC enthusiasts who want a showcase-worthy rig without sacrificing thermal performance or expandability. Its modern I/O panel includes USB 3.2 Gen2 Type-C for fast connectivity, rounding out a well-balanced chassis for next-gen systems.
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